The Union Cabinet today has approved four new semiconductor manufacturing projects worth around ₹4,600 crore. One of the major projects will be set up in Andhra Pradesh, thanks to double engine government.
The Andhra Pradesh unit will be established by Advanced System in Package Technologies (ASIP) in partnership with APACT Co. Ltd from South Korea. This facility will have the capacity to produce 96 million semiconductor units every year. The products made here will be used in mobile phones, set-top boxes, automobiles, and other electronic devices.
Apart from Andhra Pradesh, the approvals also cover projects in Odisha and Punjab. The Odisha units will focus on compound semiconductors and advanced packaging technology, while the Punjab unit will expand high-power semiconductor production.
Together, these four projects are expected to create over 2,000 direct jobs for skilled professionals and many more indirect jobs across the electronic manufacturing supply chain.
This is the first time Andhra Pradesh will host such an advanced semiconductor manufacturing unit, marking a major step in India’s plan to strengthen domestic chip production and reduce dependence on imports.
With these new approvals, India now has 10 semiconductor projects under the India Semiconductor Mission with a total investment of about ₹1.6 lakh crore spread across six states.
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